A newly discovered “nano-structured” copper alloy could redefine high-temperature materials for aerospace, defence and other next generation engineering projects.
The US breakthrough created a copper-tantalum-lithium alloy called “Cu-Ta-Li” with exceptional thermal stability and mechanical strength that’s now seen as one of the most resilient copper-based materials ever produced.
Even when subjected to 1472 degrees Fahrenheit—or 800 degrees Celsius—for over a year it showed a minimal loss of yield strength and held its shape even near its melting point.
By merging the high-temperature resilience of nickel-based superalloys with copper—which is known for exceptional conductivity—the material paves the way for next-generation industrial applications. These include heat exchangers, advanced propulsion systems, and thermal management solutions for cutting-edge missile and hypersonic technologies.
The space age alloy offers a balance of properties not found in other materials. For example nickel based superalloys lack the same high thermal conductivity, while tungsten-based alloys are dense and difficult to manufacture.
The US Army Research Laboratory was awarded a patent for the alloy, highlighting its strategic significance, particularly in defence applications like military heat exchangers, propulsion systems and hypersonic vehicles.
“This is cutting-edge science, developing a new material that uniquely combines copper’s excellent conductivity with strength and durability,” said Martin Harmer, the Alcoa Foundation Professor Emeritus of Materials Science and Engineering at Lehigh University.
A number of groups were involved in the startling find, including the US Army, Lehigh University, Arizona State University and Louisiana State University. The findings were recently published in the journal Science.