An electrochemical breakthrough opens up the possibility of 3D printing copper directly onto fabrics for next generation smart clothing—and that could change manufacturing of wearable technology for ever.
The two-step additive manufacturing process was discovered by researchers at the Department of Electrical Engineering at the University of South Florida, making it easier to miniaturize device circuitry so it adheres more easily to fabrics and other surfaces.
First, laser printing technology is used to apply a conductive template to fabric. In the next step, electroplate copper is used to produce a continuous copper pattern that forms the circuit layout of the electronic component on the fabric.
The specially designed nozzle mounted on a 3D printing device enables localized electroplating and makes it possible to make the copper grow in the junctions between the electronic components’ terminals and the circuit printed layout.
The new method increases the voltage applied during the process, making the process faster and enhancing the mechanical stability of the printed structure.
The new method is called hydrogen evolution assisted (HEA) electroplating was developed by Department of Electrical Engineering Associate Professor Arash Takshi and USF Research & Innovation Interim Vice President and Professor Sylvia Thomas.
The type of technology that can be embedded into fabric is limited only by the imagination, and Arash Takshi sees his invention primarily beneficial in several sectors—health, military and personal performance monitors.
https://www.usf.edu/engineering/news-room/takshi-wearable-technology.aspx
